Enhancement of the Unified Constitutive Model for Viscoplastic Solders in Wide Strain Rate and Temperature Ranges
Crossref DOI link: https://doi.org/10.1007/s11223-020-00142-5
Published Online: 2020-02-12
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, W. J.
Long, X.
Du, C. Y.
Fu, Y. H.
Yao, Y.
Wu, Y. P.
Text and Data Mining valid from 2019-11-01
Version of Record valid from 2019-11-01
Article History
Received: 10 December 2018
First Online: 12 February 2020