Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly
Crossref DOI link: https://doi.org/10.1007/s11431-016-0588-6
Published Online: 2016-10-17
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, JianKui
Xu, ZhouLong
Huang, YongAn
Duan, YongQing
Yin, ZhouPing
License valid from 2016-10-17