A CMOS compatible process for monolithic integration of high-aspect-ratio bulk silicon microstructures
Crossref DOI link: https://doi.org/10.1007/s11432-014-5138-0
Published Online: 2014-06-16
Published Print: 2014-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Qian, Liang
Yang, ZhenChuan
Yan, GuiZhen
Text and Data Mining valid from 2014-06-16