3D resistive RAM cell design for high-density storage class memory—a review
Crossref DOI link: https://doi.org/10.1007/s11432-016-5566-0
Published Online: 2016-03-09
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hudec, Boris
Hsu, Chung-Wei
Wang, I-Ting
Lai, Wei-Li
Chang, Che-Chia
Wang, Taifang
Fröhlich, Karol
Ho, Chia-Hua
Lin, Chen-Hsi
Hou, Tuo-Hung
Text and Data Mining valid from 2016-03-09