A physics-based electromigration reliability model for interconnects lifetime prediction
Crossref DOI link: https://doi.org/10.1007/s11432-020-3140-4
Published Online: 2021-10-12
Published Print: 2021-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cai, Linlin
Chen, Wangyong
Kang, Jinfeng
Du, Gang
Liu, Xiaoyan
Zhang, Xing
Text and Data Mining valid from 2021-10-12
Version of Record valid from 2021-10-12
Article History
Received: 21 October 2020
Accepted: 14 December 2020
First Online: 12 October 2021