Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint
Crossref DOI link: https://doi.org/10.1007/s11661-020-05956-1
Published Online: 2020-09-16
Published Print: 2020-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ni, Z. L.
Yang, J. J.
Wang, X. X.
Huang, L.
Ye, F. X.
Text and Data Mining valid from 2020-09-16
Version of Record valid from 2020-09-16
Article History
Received: 2 May 2020
Accepted: 30 July 2020
First Online: 16 September 2020