Ultrafine-Grained Microstructure Development in Cu/Fe Multilayered Sheet During Cooling
Crossref DOI link: https://doi.org/10.1007/s11661-023-07168-9
Published Online: 2023-08-22
Published Print: 2023-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kato, Ryusei
Koga, Norimitsu
Watanabe, Chihiro
Text and Data Mining valid from 2023-08-22
Version of Record valid from 2023-08-22
Article History
Received: 1 June 2023
Accepted: 5 August 2023
First Online: 22 August 2023
Conflict of Interest
: The authors declare that they have no conflict of interest.