Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar–O2 Mixed Gas
Crossref DOI link: https://doi.org/10.1007/s11661-024-07392-x
Published Online: 2024-04-16
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ueshima, Yoshiyuki
Hasegawa, Masakatsu
Kubota, Naoyoshi
Matamura, Yuya
Matsubara, Eiichiro
Seki, Kazuaki
Hirato, Tetsuji
Text and Data Mining valid from 2024-04-16
Version of Record valid from 2024-04-16
Article History
Received: 2 October 2023
Accepted: 20 March 2024
First Online: 16 April 2024