Study of Solidification and Heat Transfer Behavior of Mold Flux Through Mold Flux Heat Transfer Simulator Technique: Part II. Effect of Mold Oscillation on Heat Transfer Behaviors
Crossref DOI link: https://doi.org/10.1007/s11663-015-0367-1
Published Online: 2015-05-19
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ma, Fanjun
Liu, Yongzhen
Wang, Wanlin
Zhang, Haihui
Text and Data Mining valid from 2015-05-19
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Article History
First Online: 19 May 2015