Understanding of Void Formation in Cu/Sn-Sn/Cu System During Transient Liquid Phase Bonding Process Through Diffusion Modeling
Crossref DOI link: https://doi.org/10.1007/s11663-018-1391-8
Published Online: 2018-08-21
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bordère, Sylvie
Feuillet, Emilien
Diot, Jean-Luc
de Langlade, Renaud
Silvain, Jean-François
Text and Data Mining valid from 2018-08-21
Version of Record valid from 2018-08-21
Article History
Received: 26 January 2018
First Online: 21 August 2018