A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler
Crossref DOI link: https://doi.org/10.1007/s11664-014-3159-5
Published Online: 2014-05-01
Published Print: 2014-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Jin
Zhang, Haiyan
Hong, Haoqun
Liu, Hui
Zhang, Xiubin
Text and Data Mining valid from 2014-05-01