Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection
Crossref DOI link: https://doi.org/10.1007/s11664-014-3282-3
Published Online: 2014-07-11
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Miyauchi, Kazuhiro
Yamashita, Yukihiko
Suzuki, Naoya
Takano, Nozomu
Text and Data Mining valid from 2014-07-11