The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading
Crossref DOI link: https://doi.org/10.1007/s11664-014-3298-8
Published Online: 2014-07-22
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mattila, Toni T.
Hokka, Jussi
Paulasto-Kröckel, Mervi
Text and Data Mining valid from 2014-07-22