Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation
Crossref DOI link: https://doi.org/10.1007/s11664-014-3306-z
Published Online: 2014-08-19
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Ying
Balaraju, J. N.
Huang, Yizhong
Tay, Yee Yan
Shen, Yiqiang
Tsakadze, Zviad
Chen, Zhong
Text and Data Mining valid from 2014-08-19