Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish
Crossref DOI link: https://doi.org/10.1007/s11664-014-3315-y
Published Online: 2014-07-30
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Tae-Kyu
Duh, Jeng-Gong
Text and Data Mining valid from 2014-07-30