An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-014-3332-x
Published Online: 2014-08-20
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, K. M.
Wu, C. Y.
Wang, C. H.
Cheng, H. C.
Huang, N. C.
Text and Data Mining valid from 2014-08-20