Cyclic Thermal Stress-Induced Degradation of Cu Metallization on Si3N4 Substrate at −40°C to 300°C
Crossref DOI link: https://doi.org/10.1007/s11664-014-3357-1
Published Online: 2014-09-17
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lang, Fengqun
Yamaguchi, Hiroshi
Nakagawa, Hiroshi
Sato, Hiroshi
Text and Data Mining valid from 2014-09-17