Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
Crossref DOI link: https://doi.org/10.1007/s11664-014-3400-2
Published Online: 2014-09-13
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, Xu
Saka, Masumi
Muraoka, Mikio
Yamashita, Mitsuo
Hokazono, Hiroaki
Text and Data Mining valid from 2014-09-13