Nanocopper Based Solder-Free Electronic Assembly
Crossref DOI link: https://doi.org/10.1007/s11664-014-3478-6
Published Online: 2014-11-01
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Schnabl, K.
Wentlent, L.
Mootoo, K.
Khasawneh, S.
Zinn, A. A.
Beddow, J.
Hauptfleisch, E.
Blass, D.
Borgesen, P.
License valid from 2014-11-01