Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
Crossref DOI link: https://doi.org/10.1007/s11664-014-3530-6
Published Online: 2014-12-02
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Linmei
Zhang, Z. F.
Text and Data Mining valid from 2014-12-02