Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders
Crossref DOI link: https://doi.org/10.1007/s11664-014-3537-z
Published Online: 2014-12-04
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Xu
Zhou, Jian
Xue, Feng
Bai, Jing
Yao, Yao
Text and Data Mining valid from 2014-12-04