Nonaqueous Halide-Free Flux Reactions with Tin-Based Solders
Crossref DOI link: https://doi.org/10.1007/s11664-015-3635-6
Published Online: 2015-01-29
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Qu, Guoying
Weinman, Craig J.
Ghosh, Tanushree
Flake, John C.
Text and Data Mining valid from 2015-01-29