In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates
Crossref DOI link: https://doi.org/10.1007/s11664-015-3780-y
Published Online: 2015-04-24
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hsu, Hsueh Hsien
Chen, Hao
Ouyang, Yao Tsung
Chiu, Tz Cheng
Chang, Tao Chih
Lee, Hsin Yi
Ku, Chin Shun
Wu, Albert T.
Text and Data Mining valid from 2015-04-24