Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate
Crossref DOI link: https://doi.org/10.1007/s11664-015-3781-x
Published Online: 2015-04-17
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ko, Yong-Ho
Kim, Min-Su
Bang, Junghwan
Kim, Taek-Soo
Lee, Chang-Woo
Text and Data Mining valid from 2015-04-17