Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads
Crossref DOI link: https://doi.org/10.1007/s11664-015-3931-1
Published Online: 2015-07-21
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Menon, Sandeep
Osterman, Michael
Pecht, Michael
Text and Data Mining valid from 2015-07-21