Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
Crossref DOI link: https://doi.org/10.1007/s11664-015-4024-x
Published Online: 2015-09-14
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Myung, Woo-Ram
Kim, Yongil
Jung, Seung-Boo
Text and Data Mining valid from 2015-09-14