Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects
Crossref DOI link: https://doi.org/10.1007/s11664-015-4043-7
Published Online: 2015-09-22
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Zhiwen
Liu, Changqing
Wu, Yiping
An, Bing
Text and Data Mining valid from 2015-09-22