Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-015-4065-1
Published Online: 2015-09-30
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liang, Chien-Lung
Lin, Kwang-Lung
Peng, Jr-Wei
Funding for this research was provided by:
Ministry of Science and Technology of the Republic of China (NSC101-2221-E-006-117-MY3)
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