Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages
Crossref DOI link: https://doi.org/10.1007/s11664-015-4066-0
Published Online: 2015-10-06
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Talebanpour, B.
Huang, Z.
Chen, Z.
Dutta, I.
Funding for this research was provided by:
Semiconductor Research Corporation (1292.088)
Text and Data Mining valid from 2015-10-06