Quantitative Analysis of Porosity and Transport Properties by FIB-SEM 3D Imaging of a Solder Based Sintered Silver for a New Microelectronic Component
Crossref DOI link: https://doi.org/10.1007/s11664-015-4288-1
Published Online: 2016-01-12
Published Print: 2016-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rmili, W.
Vivet, N.
Chupin, S.
Le Bihan, T.
Le Quilliec, G.
Richard, C.
Text and Data Mining valid from 2016-01-12