An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen
Crossref DOI link: https://doi.org/10.1007/s11664-016-4456-y
Published Online: 2016-03-22
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ohguchi, Ken-ichi
Kurosawa, Kengo
Funding for this research was provided by:
Japan Science and Technology Agency (AS232Z01992C)
Text and Data Mining valid from 2016-03-22
Version of Record valid from 2016-03-22
Article History
Received: 24 August 2015
Accepted: 8 March 2016
First Online: 22 March 2016