Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Crossref DOI link: https://doi.org/10.1007/s11664-016-4504-7
Published Online: 2016-04-12
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sona, Mrunali
Prabhu, K. Narayan
Funding for this research was provided by:
DRDO (ERIP/ER/1006009M/01/1356)
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