Crossmark

Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K

Crossref DOI link: https://doi.org/10.1007/s11664-016-4519-0

Published Online: 2016-04-20

Published Print: 2016-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Agyakwa, Pearl A.

Yang, Li

Arjmand, Elaheh

Evans, Paul

Corfield, Martin R.

Johnson, C. Mark
Funding

Funding for this research was provided by:

Innovative electronics Manufacturing Research Centre (EP/H03014X/1)
License Information

License valid from 2016-04-20