Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics
Crossref DOI link: https://doi.org/10.1007/s11664-016-4753-5
Published Online: 2016-07-01
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bernasconi, R.
Molazemhosseini, A.
Cervati, M.
Armini, S.
Magagnin, L.
License valid from 2016-07-01