Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu
Crossref DOI link: https://doi.org/10.1007/s11664-016-4773-1
Published Online: 2016-07-11
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Hwa-Teng
Huang, Kuo-Chen
License valid from 2016-07-11