Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB
Crossref DOI link: https://doi.org/10.1007/s11664-016-4803-z
Published Online: 2016-07-28
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Jungsoo
Myung, Woo-Ram
Jung, Seung-Boo
License valid from 2016-07-28