Incorporating the Johnson–Cook Constitutive Model and a Soft Computational Approach for Predicting the High-Temperature Flow Behavior of Sn-5Sb Solder Alloy: A Comparative Study for Processing Map Development
Crossref DOI link: https://doi.org/10.1007/s11664-016-4887-5
Published Online: 2016-09-08
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vafaeenezhad, H.
Seyedein, S. H.
Aboutalebi, M. R.
Eivani, A. R.
License valid from 2016-09-08