Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock
Crossref DOI link: https://doi.org/10.1007/s11664-016-4965-8
Published Online: 2016-11-01
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Han, Jing
Tan, Shihai
Guo, Fu
Funding for this research was provided by:
National Natural Science Foundation of China (No. 51401006)
Beijing Natural Science Foundation (No. 2162005)
License valid from 2016-11-01