Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content
Crossref DOI link: https://doi.org/10.1007/s11664-017-5376-1
Published Online: 2017-02-27
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pettersen, Sigurd R.
Redford, Keith
Njagi, John
Kristiansen, Helge
Helland, Susanne
Kalland, Erik
Goia, Dan V.
Zhang, Zhiliang
He, Jianying
Funding for this research was provided by:
Norges Forskningsråd (225962/E20)
License valid from 2017-02-27