Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill
Crossref DOI link: https://doi.org/10.1007/s11664-017-5516-7
Published Online: 2017-04-20
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Kuo-Tsai
Hwang, Sheng-Jye
Lee, Huei-Huang
License valid from 2017-04-20