Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-017-5821-1
Published Online: 2017-10-04
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Seo, Wonil
Kim, Kyoung-Ho
Kim, Young-Ho
Yoo, Sehoon http://orcid.org/0000-0001-7036-6188
Funding for this research was provided by:
Ministry of Trade, Industry, and Energy
License valid from 2017-10-04