Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications
Crossref DOI link: https://doi.org/10.1007/s11664-017-5883-0
Published Online: 2017-10-25
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Hwan-Pil
Seo, Gwancheol
Kim, Sungchul
Kim, Young-Ho http://orcid.org/0000-0003-3634-2857
License valid from 2017-10-25