Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics
Crossref DOI link: https://doi.org/10.1007/s11664-018-6311-9
Published Online: 2018-04-26
Published Print: 2018-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Piotrowska, Kamila http://orcid.org/0000-0002-0864-0681
Ud Din, Rameez
Grumsen, Flemming Bjerg
Jellesen, Morten Stendahl
Ambat, Rajan
Text and Data Mining valid from 2018-04-26
Article History
Received: 15 January 2018
Accepted: 18 April 2018
First Online: 26 April 2018