Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection
Crossref DOI link: https://doi.org/10.1007/s11664-018-6385-4
Published Online: 2018-05-31
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pun, Kelvin P. L.
Islam, M. N.
Rotanson, Jason
Cheung, Chee-wah
Chan, Alan H. S.
Text and Data Mining valid from 2018-05-31
Article History
Received: 23 January 2018
Accepted: 12 May 2018
First Online: 31 May 2018