Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates
Crossref DOI link: https://doi.org/10.1007/s11664-018-6434-z
Published Online: 2018-06-20
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ajay Kumar, P.
Dutta, I.
Funding for this research was provided by:
Missile Defense Agency (HQ0147-15-C-6002)
Text and Data Mining valid from 2018-06-20
Version of Record valid from 2018-06-20
Article History
Received: 21 November 2017
Accepted: 5 June 2018
First Online: 20 June 2018