Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies
Crossref DOI link: https://doi.org/10.1007/s11664-018-6600-3
Published Online: 2018-08-22
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Samavatian, Majid
Ilyashenko, Lubov K.
Surendar, A.
Maseleno, Andino
Samavatian, Vahid
Text and Data Mining valid from 2018-08-22
Article History
Received: 6 May 2018
Accepted: 9 August 2018
First Online: 22 August 2018