Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-018-6679-6
Published Online: 2018-09-22
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kannojia, Harindra Kumar
Sharma, Surender Kumar
Dixit, Pradeep http://orcid.org/0000-0001-6706-1877
Text and Data Mining valid from 2018-09-22
Article History
Received: 22 May 2018
Accepted: 14 September 2018
First Online: 22 September 2018