Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
Crossref DOI link: https://doi.org/10.1007/s11664-019-07681-x
Published Online: 2019-10-22
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nayak, Sagar Kumar http://orcid.org/0000-0003-3539-1083
Mohanty, Smita
Nayak, Sanjay K.
Funding for this research was provided by:
Board of Research in Nuclear Sciences (project No.39/14/01/2018-BRNS/39001).)
Text and Data Mining valid from 2019-10-22
Version of Record valid from 2019-10-22
Article History
Received: 12 April 2019
Accepted: 25 September 2019
First Online: 22 October 2019