Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads
Crossref DOI link: https://doi.org/10.1007/s11664-019-07811-5
Published Online: 2019-11-26
Published Print: 2020-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
George, Elviz
Chen, Deng Yun http://orcid.org/0000-0001-9165-4197
Osterman, Michael
Pecht, Michael
Funding for this research was provided by:
Center for Advanced Life Cycle Engineering
Text and Data Mining valid from 2019-11-26
Version of Record valid from 2019-11-26
Article History
Received: 17 November 2018
Accepted: 6 November 2019
First Online: 26 November 2019