Insulation Failure Mechanism of Immersion Silver Finished Printed Circuit Board Under NaCl Solution
Crossref DOI link: https://doi.org/10.1007/s11664-019-07885-1
Published Online: 2019-12-23
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, Yilin http://orcid.org/0000-0002-2161-4381
Li, Ying
Chen, Yanyu
Funding for this research was provided by:
National Natural Science Foundation of China (61674017)
Text and Data Mining valid from 2019-12-23
Version of Record valid from 2019-12-23
Article History
Received: 23 September 2019
Accepted: 6 December 2019
First Online: 23 December 2019